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Many Choices, One Solution
(314) 961-7400
Many Choices, One Solution
(314) 961-7400

Products/Capabilities

Min/Max
Layer Count: 1 to 56 Layers
Material: XPC/FR1/FR2/CEM1/CEM3/FR4/High Tg FR4/Halogen-Free/Rogers/BT/PTFE/Mixed Materials/Teflon/Getek/Megtron/BT/PTFE/Arlon/Taconic/NELCO
Copper (Max): 6 Ounces
Line Width / Space: 3/3 Mils
Technology: Gold Fingers/POFV/HDI/Backplane/Back Drilling/Buried Capacitor/Buried Resistor/Rigid and Flexible PCBs/Heat Sinks/Silver Thru Hole/Metal Core PCB/Via-in-Pads Design/Depth Control Cavity/Micro via Hole Filling Technology (Resin)
Blind/Buried Vias: HDI Yes (1+N+1, 2+N+2, 3+N+3 and Every Layer Interconnect (ELIC))
Maximum Aspect Ratio: 16:1
Surface Finish: HASL/LF-HASL/Immersion Tin/Immersion Gold/Immersion Silver/Hard Au/Selective OSP/OSP/Bondable Au/Electrolytic Gold/Flash Gold
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Other Products:
  • LCDs/LCMs
  • Batteries
  • Wire Harness
  • Heat Sinks
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Address

1246 Hanley Industrial Court
St Louis, MO 63144
Phone: (314) 961-7400
Email: info@theecmg.com
We are open 24/7
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